Only provides support for Intel 15th generation CPU the motherboard CPU socket is LGA1851.
The original buckle is used and the buckle force point is in the middle of the CPU and the support point of the CPU cover will be worn to a certain extent.
All aluminum alloy is used. CNC precision manufacturing anodized sandblasting multi-color optional
Precise positioning Avoid capacitors and use LOTES original insulation protection pads of the same specification
Protect CPU cover from pulling off while remove coolers, no heat dissipation.
Assist heat dissipation from smooth IHS surface
Product Specifications:
Material:Material: aluminum alloy (AL6063-T5)
Color: Black
Size:Length 53.5mmx Width 70mmx Height 6.25mm
Weight: 55g
Packages:
1 X CPU Bending Corrector
1 X L-shaped Screwdriver
Recommended for new CPU installation
Applicable: CPU Ultra 200s series.
LGA1851-BCF (Bending Corrector Frame) to mitigate the risk of bending and warping with 15th Generation Arrow Lake processors. Intel has previously disclosed that their processors could exhibit mild warping as a result of changes to the integrated heatspreader (IHS) design but that the processors still performed within specification. This new product from Thermalright aims to prevent this warping despite Intel advising that any 3rd party modifications could void the warranty for processors. The Thermalright LGA1851-BCF support for Z890 motherboards.
Thermalright creates an anti-bend solution for Intel's Arrow Lake processors
Intel's Arrow Lake processors are prone to flexing and warping a flaw with the Intel LGA1851 CPU's latching system. In response to this problem an -anti-bend frame- was developed designed to prevent warping/bending of Arrow Lake CPUs.
The LGA1851-BCF an aluminum frame that replaces the CPU mounting mechanism of the company's LGA1851 CPU socket. This frame fits around the processor and is secured with simple screws. The frame applies more even pressure to Intel's Arrow Lake processors reducing the chance of warping. However Intel warns that this mounting solution could void your CPU warranty so consumers should be aware of this.
This LGA 1851 Anti-Bend Buckle adopts an all-aluminum CNC gold anodized sandblasting process with an overall size of 70 x 53.5 x 6.25 mm and an overall weight of 55g. Its precise positioning can avoid the capacitors on the motherboard and uses the original LOTES insulation protection pads and also provides different color schemes